Printed Circuit Board Assembly Inspection
Conduct appropriate inspections according to the situation! Inspections of BGA solder conditions that cannot be confirmed visually are also included.
Inspection of the implemented circuit boards is conducted using microscopes, AOI visual inspection devices, and X-ray inspection devices, with appropriate inspections carried out according to the situation. The X-ray inspection device can also inspect the solder conditions of BGA, which cannot be confirmed visually. We strive to perform work that is faster and more accurate. Our circuit board assembly manufacturing group accepts customer needs at any point in the process, from circuit design to prototyping and mass production. 【Features】 ■ Conduct appropriate inspections according to the situation ■ The X-ray inspection device can inspect the solder conditions of BGA, which cannot be confirmed visually *For more details, please refer to the PDF document or feel free to contact us.
- 企業：パスコン
- 価格：Other
